FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
Reflow Soldering PCB Temperature Curve Explanation
What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
PCB Protection: Potting or Conformal Coating? | PCB Knowledge
FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Preparation of FPC based on ultrasonic spraying method_1_abstract




Abstract: A ultrasonic spray coating method suitable for printing circuits on different kind of flexible substrates was introduced.The fabrication of flexible printed circuit (FPC) via this method is highly efficient and more environmentally friendly. The main principle is that the nano-silver conductive ink is atomized by the ultrasonic nozzle and then sprayed on the polyimide (PI) film which is covered with a metal mask. After patterning on PI film, the ink is sintered at 125 °C for 20 min and the flexible circuit is achieved. The test results showed that the patterned circuit with a width of 500 m maintains good conductivity after repeatedly bending for several times. The surface sheet resistance of the inkjet-printed silver layer on PI film is steadily decreased with the increasing of the number of silver layers deposited. In the case of eight prints, the sheet resistance is 21±2 milli-ohm/sq. The observation by scanning electron microscope showed that the morphology of the circuit is level and smooth, and the average error of burr is within 50 um.

In the information age, people transmit and process data through various electronic products every day. As the carrier medium, the demand for Printed Circuit Boards (PCBs) is also increasing year by year [1-3]. Flexible Printed Circuits (FPCs) have the characteristics of high wiring density, lightness, and good bendability, so they are increasingly occupying a larger proportion of PCBs [4]. FPCs usually refer to printed circuit boards made with flexible plastic films as substrates, which can be directly applied in three-dimensional working environments, accelerating the development of fields such as biomedical and human-machine information exchange, and further broadening the application areas of current electronic products .


The earliest FPC technology appeared in a British patent published in 1898, which described flat conductor circuits made on paraffin paper substrates. However, it was not until the late 20th century that FPCs began to be widely researched both domestically and internationally after being used in modern consumer electronic products such as car dashboards, instruments, mobile phones, and OLED (Organic Light Emitting Diode) flexible screens.


Flexible single-sided boards are currently the most widely used type of FPCs. The main production methods for this kind of printed board at home and abroad are sheet-to-sheet and roll-to-roll (R2R) [8]. Sheet-to-sheet production involves cutting flexible substrates into individual pieces and producing them on a piece-by-piece basis. Its advantages include low investment and flexible product variety, but it is inefficient. Roll-to-roll production involves winding the product into rolls and driving it through positioning holes at the edges for continuous operation. The European Flex-o-Fab project used the roll-to-roll process to produce flexible OLED prototypes. This method has a high degree of automation, suitable for mass production, but requires a large investment in production equipment and lacks flexibility in product variety changes [9]. Although there are two methods for producing flexible single-sided boards, their production processes are basically the same, with the most commonly used being printing and etching. The process includes lamination, exposure, development, and etching. The etching process not only wastes resources but also causes certain damage to the environment. Therefore, finding a method that can effectively solve these problems is particularly important.


This article proposes a design that uses ultrasonic atomization spraying to coat conductive layers on flexible substrates. A metal mask is placed on the flexible substrate, and the required conductive traces and electrodes are produced according to design requirements. By using the principle of ultrasonic atomization, conductive ink is atomized into nano-sized particles, which are then guided by airflow to coat the substrate along a specific path. Using this method, the coating thickness can reach the nanometer level, allowing for convenient control of the coating thickness according to actual production needs. Ultrasonic spraying can flexibly change the types of products, ensure full automation of equipment, and guarantee production efficiency. Moreover, excess ink can be recycled, reducing waste and environmental damage. Introducing ultrasonic spraying into the manufacturing of flexible printed circuits will have a promising application prospect.

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "Humanized way to make Flex PCB". Choose us,
    you will have the best flex PCB and assembly partner.


© 2023-2033 FPCWAY All Rights Reserved