FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)


The base material for FPC is FCCL and the structures are Copper +PI, Copper + AD + PI, Copper + PI +Copper or Copper + AD + PI + AD + Copper.



Originally, copper is very key for the flex circuits material. Which kind of copper we could choose? The answer is ED Copper (Electrodeposited Copper Foil) and RA copper (Rolled Annealed Copper Foil). Then what the difference between these two? I will show it from below 4 aspects: 


1. Definition & Manufacturing Method 


Different copper is defined by its manufacturing method. ED Copper, which is made from CuSO4 solution, by using electrolysis method, made Cu2+ dip into spinning cathode rolls and stripping, then made it into ED copper. RA Copper, which is made from high purity copper(>99.98%), by using pressure process, made copper into different copper thickness. 


2. Form 


ED Copper (Electrodeposited Copper Foil) and RA Cooper (Rolled Annealed Copper Foil) 


3. Performance 


Due to different manufacturing methods and different shapes, the performance of them is not same. ED copper has better conductivity than RA copper. While as for extensibility, RA copper is much better than ED copper. 


4. Application 


Because of different performances, RA copper and ED copper are used in different products which tend to different product requests. Normally, ED copper is always used for static application and RA copper is always used in dynamic application. For example, the flex board needs to be bendable a lot, so obviously, RA copper will be a good choice. Otherwise, we could use ED copper with high electrical conductivity. Whatever, you should select copper according to your circuits' requests (final board performance, cost, function...)

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  • Based in Shenzhen China, FPCway is professional at Flex PCB,
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