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Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
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What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
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FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
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Control Impedance Between Rigid PCB and Flex PCB
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Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
About ENIG and ENEPIG
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
About_Wave_Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Flexible or flex printed circuit boards are popular PCB type designed to fulfill the needs of flexible electronic circuits. Flex circuit boards are the fastest replacement for traditional wire harnesses as they can be easily shaped to fit into various complex circuit designs. Additionally, these circuit boards provide freedom of designing while maintaining their performance and density. The performance of the flex circuit board entirely relies on primary materials. Selecting the optimum materials is essential to the success of a flex circuit board fabrications. There are different varieties of materials, and configurations are available to fulfill the needs of modern design applications. This post will guide you to find out different aspects of materials used in the flex circuit board fabrication. 

 

Types of Flexible Core or Substrate Materials Used in Flex Circuit Board Fabrication 

 

The core materials of flex circuit boards are made of adhesive as well as non-adhesive materials. Both are supplied with a range of polyimide core thicknesses. 

 

Adhesive-based Flex Materials: Adhesive-based materials are a mainstay of the flexible circuit materials and commonly used in single- and double-sided circuit board designs. As its name implies, they make use either epoxy- or acrylic-based adhesives to glue the copper to the flex core. Adhesive-based flex materials offer a wide range of benefits including higher copper peel strength, reduction of material costs, and more. 

 

Non-adhesive Flex Materials: This type of flex core materials are manufactured as either sputtered copper on dielectric film or cast dielectric on copper. They are commonly used when the design is a rigid or higher layer count flex construction. In both situations, non-adhesive flex core offers superior quality and reliability. Non-adhesive materials are widely used for several reasons. One major advantage of this material is the elimination of the adhesive layers, which results in flexible and thin construction. Other benefits of non-adhesive flex materials include tighter possible minimum bend radius, higher potential temperature ratings, and many more. 

 

Conductor Materials Used in Flex Circuit Board Fabrication 

 

It is possible to achieve high-level flex circuit board fabrication using the thin, fine-grained, low profile copper foils. Mainly, there are two types of copper foils available in both flex material configurations: electro-deposited (abbreviated as ED) and rolled annealed (abbreviated as RA). Both adhesive-based and non-adhesive start as electro-deposited copper; however, during the rolled annealing process the grain structure transforms from the vertical ED to horizontal RA copper. 

 

Coupled with a relatively lower cost, ED copper foil has gained immense popularity in the market. RA foil is quite expensive but comes with improved bend capabilities. Additionally, RA foil is a standard material required for dynamic flex applications. 

 

Coverlay and Flexible Soldermask Materials for Flex Circuit Board Fabrication 

 

Flex printed circuit boards consist of external layer circuitry enclosed with either a flexible soldermask, coverlay, or a combination of both. PCB manufacturers previously used adhesives to glue the layers, which reduced the reliability of the circuit boards to some extent. To resolve such issues, most of them now prefer coverlays owing to their improved reliability and flexibility. Coverlay features a solid layer of polyimide with either an acrylic or epoxy adhesive. Similarly, flexible soldermask is a preferred material for rigidized component areas with high-density Surface Mount Technology (SMT) components. A good design practice utilizes both soldermask in component areas and coverlay in flex areas to make the best use of their capabilities. 

 

The flex circuit board has gained immense popularity over the years and find large applications with complex circuitry. It is important to choose the correct flexible PCB materials as this will not only affect the board performance but the overall cost of the circuit board. If you still have any doubts, do contact one of the leading industry experts who can help you find the best possible solution for your electronic application. FPCway is a reliable industry player specializing in single-layer, double-layer, multilayer, flexible, rigid-flex, rigid PCBs.

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
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