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FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
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Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
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Research progress on polyimide FPC_2_the field of FPC
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Analysis of Vibration Characteristics of FPCBs _4_Summary
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Research on Design Methods for FPCBs
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Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

FPCway is also a professional PCB Assembly manufacturer in Shenzhen China. Own 8 professional SMT lines (JUKI, GKG, YAMAHA, KIC, etc.), we could provide our customers the best service and best quality, all PCB assembly boards will pass strict visual inspection, AOI and X-Ray test (if have BGA) before shipping to customers.

 

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

 

An SMT component is usually smaller than the through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

 

Because "surface-mount" refers to a methodology of manufacturing, there are different terms used when referring to the different aspect of the method, which distinguishes for example the components, technique, and machines used in manufacturing. These terms are listed in the following table:

 

SMp term  Expanded form
SMDSurface-mount devices (active, passive and electromechanical components)
SMTSurface-mount technology (assembling and mounting technology)
SMASurface-mount assembly (module assembled with SMT)
SMC Surface-mount components (components for SMT)
SMPSurface-mount packages (SMD case forms)
SMESurface-mount equipment (SMT assembling machines)

 

  Hope above information help you know more about SMT. 

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