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PCB Assembly Blog
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About PCB Assembly
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Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
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Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
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About_Wave_Soldering
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FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
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Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
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Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
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Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

About Surface Mount Technology

 

FPCway is also a professional PCB Assembly manufacturer in Shenzhen China. Own 12 professional SMT lines (JUKI, GKG, YAMAHA, KIC, etc.), we could provide our customers the best service and best quality, all PCB assembly boards will pass strict visual inspection, AOI and X-Ray test (if have BGA) before shipping to customers.

 

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

 

An SMT component is usually smaller than the through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

 

Because "surface-mount" refers to a methodology of manufacturing, there are different terms used when referring to the different aspect of the method, which distinguishes for example the components, technique, and machines used in manufacturing. These terms are listed in the following table:

 

SMp termExpanded form
SMDSurface-mount devices (active, passive and electromechanical components)
SMTSurface-mount technology (assembling and mounting technology)
SMASurface-mount assembly (module assembled with SMT)
SMCSurface-mount components (components for SMT)
SMPSurface-mount packages (SMD case forms)
SMESurface-mount equipment (SMT assembling machines)

 

Hope above information help you know more about SMT. 

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  • Based in Shenzhen China, FPCway is professional at Flex PCB,
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