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What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
PCB Protection: Potting or Conformal Coating? | PCB Knowledge
FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
Future Trends of Flexible Circuit Boards
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Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

The performance and shelf life of an electrical system directly depends on the integrity of flex-rigid PCBs. Hence, manufacturers must pay utmost attention when designing and manufacturing the PCBs. Any design or manufacturing flaw considerably affects the performance and productivity of the boards.  


Best Practices in Flex-Rigid PCBs Manufacturing 


Following the right manufacturing practices and standards helps in producing rigid-flex PCBs with unmatched quality and functionality. There are some standard guidelines to be considered when designing and manufacturing rigid-flex circuit boards. 


The following guidelines can act as a checklist to produce rigid-flex circuit board without any design and manufacturing defect. 


Decide on the manufacturing processes and materials in advance, based on how much ‘flex’ is needed. This can be understood with an example. If the boards you are designing are only folded during the manufacturing process, and then kept in a fixed position without any bend, you are free to decide on the: 


.Type and grade of copper 


.Manufacturing method 


.Number of layers 


In contrast, if the board is for applications that experience frequent moves, shocks, and vibrations, you must be particular when choosing 


.Copper coils 




.Number of layers 


It is advisable to position copper traces to the right angle of the rigid flex. This is because, copper traces work superiorly when they are placed at the right angle of the board. Hence, avoid bending at the corners as it strains the copper traces. However, there are some PCB design considerations that call for bending at the corners. In such cases, you may use conical radius bends. 


Due to repeated stress caused by frequent bending, copper on the circuitry is more likely to detach from the polyimide substrate. To avoid this, provide the exposed copper traces with enough pad support. In most cases, usage of surface mount pads is found to be ineffective for this purpose. However, you can increase the reliability of the pads by using coverlay “mask” openings and anchoring stubs. 


To retain the board’s flexibility, consider using hatched polygons instead of solid copper pours. Usage of solid copper pours may result in reduced flexibility, and buckling of the copper under tight radius bends. 


It is suggested to leave at least ½ mm clearance between copper annulus and adjacent vias to avoid fatigue due to frequent bending. Place the vias in stationary areas of the board, which are not subjected to frequent bends and movements. 


Contact your raw material supplier during the design stage in case you are planning to use non-standard base dielectric materials and adhesiveless laminates. Since they come in standard sizes by special ordering, it may take time to deliver the same in your door steps. Hence, it is suggested to avoid using these materials, until the design conditions really demand using them. 


Rigid-flex PCBs manufacturing processes are laborious, requiring close attention to detail. There are several factors to be considered to produce rigid-flex PCBs with outstanding quality.


Even though, the above mentioned tips/rules seem basic, they help producing PCBs with unmatched reliability and service life.

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