FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
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What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
PCB Protection: Potting or Conformal Coating? | PCB Knowledge
FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
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Control Impedance Between Rigid PCB and Flex PCB
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Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Flexible circuits are known for their versatility. They can be folded, bent, and twisted into a variety of configurations. The success of a flex circuit is understanding that the design rules are different from a rigid circuit. The designers and engineers have to keep certain points in mind when creating a flex PCB to ensure success. To help this, we provide a few tips below. 


Tips for Flex PCB Design Success 


Let's say you are designing a 2 layer flex PCB. If you are not too careful you may produce a FPC board with many errors. Here are a few points you can perform to make your flex circuit board robust, and ready for production. 


1. Ensure Large Pad and Hole Sizes: Flexible material is easy to drill during the design process. Hence, when creating flex PCBs, the hole and pad sizes should be 10 mils at minimum. For the plating process, only use barrel size plates for the pads. The flex holes should not be plated to ensure flexibility. Also, by not plating the flex holes, it becomes easier to keep electrodeposited copper off of the PCB surface. 


2. Flexibility for Stiffeners and Coverfilms: Flexible circuitry is exposed during processes like copper plating, etching, and pumice scrubbing during fabrication. This can lead to certain dimensional changes. Designing flexible circuitry requires large tolerances to allow for stiffeners, and coverlay. Also, when considering coverlay, you also have to take the adhesive squeezing out when the coverlay dielectric is laminated. If not performed, the fabrication and inspection processes will become very difficult. Hence, you should give more room for the coverlay in a flex design. 


3. Create Hashed Ground Planes: Many industrial applications require the use of multilayer flex PCBs. However, the problem here is, when the layers are increased to 10 or 12, it becomes difficult for the PCB to bend and flex. A good way to solve this problem is to use hashed ground planes on both sides of the signal layers. 


4. Smooth Radius Layout to Prevent Stress Points: As flex circuits are used in dynamic applications, you require specialized trace configurations. This means that trace configurations used for rigid circuits cannot be used. If used, the traces with sharp corners can become stress points. Hence, ensure that the layout has a smooth radius for turn points. Also, attach stiffeners only at select places to prevent bending of soldered areas. 


5. Create Fixture for Assembly: The assembly of flex PCBs can be difficult as they are not sturdy due to the flex material. This problem can be solved by creating specialized fixtures, which provide the right amount of backing to allow for easy PCB assembly. 


By keeping such tips in mind, it may be possible to improve the flex PCB design process, and ensure the delivery of industrial grade circuit board products. If you are looking for 1-2 layer flex PCBs, or multi-layer FPC boards or Flex-rigid PCB, you can contact FPCway anytime for checking.

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
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  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
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