FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
Reflow Soldering PCB Temperature Curve Explanation
What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
PCB Protection: Potting or Conformal Coating? | PCB Knowledge
FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Application of flexible printed circuit board (FPCB) in personal computer motherboards


Focusing on mechanical performance_3_ Numerical analysis


3. Numerical analysis


3.1. Simulation tools


The FSI numerical analysis was performed using the fluid solver FLUENT 6.3.26 and structural solver ABAQUS/CAE 6.9, coupled online  by MpCCI 3.1.0. Using the MpCCI, the quantities were exchanged from one solver to the other through association (neighborhood search) and interpolation. In the present study, the air flow is solved by FLUENT, and the subsequent deformation of FPCB motherboard is addressed by ABAQUS. The deformation information is then fed back to FLUENT, and this process completes one cycle of iteration, as shown in Fig. 5.




3.2. Modeling strategy


In ABAQUS, as shown in Fig. 6, the components of the FPCB motherboard are modeled as idealized simple blocks, which are rigidly attached to the motherboard with no consideration made for attachment  flexibility. This simplified modeling technique is reliable, as demonstrated in the previous studies conducted by Pitarresi et al.As given  in Table 1, the effective elastic modulus, density, and dimensions of the various components are specified according to the experimental prototype. The fully constrained boundary condition (Ux =Uy = Uz = URx = URy = URz = 0) is assigned to the fixed regions of the motherboard, where U and UR denote linear and rotational displacements, respectively. Gravity is defined in the negative y-direction. Points A, B, C, and D are the  locations where the comparison between experimental measurements and numerical predictions are made. This structural model is meshed with 28,353 hexagonal elements.



In FLUENT, the flow is assumed to be three dimensional, lami- nar, incompressible, and unsteady. The laminar model is well sui- ted for a fan-sucking wind tunnel, as investigated by Grimes and co-workers . As  shown in Fig.7, the fluid model covers the entire test section of the wind  tunnel and is meshed with 848,175 hexagonal grids. For the purpose of  structured mesh assignment in fluid modeling, the fluid domain is appropriately split into a few smaller volumes. The motherboard stand holder is not modeled to reduce modeling complexity. In this model, the desired velocity is set at the velocity inlet boundary, and ambient condition is set at the pressure outlet boundary.



3.3. Case studies


The reliability of this FSI simulation technique was substantiated by  comparing the predictions with experimental measurements. A few   studies were conducted to investigate the deflection and stress induced in the FPCB motherboard under various conditions. First, the inlet velocities were manipulated at 1, 2, 3, 4, and 5 m/s, which are within the typical range found in electronic systems, to examine the effect of flow velocity on the motherboard. In addition, different fastening options were considered, as shown in Fig. 8. Due to the fact that the motherboard is commonly screw-fastened at several points in actual applications.



Fastens 2 and 3 were considered to discover the screw-fastening effects. Fastens 4 and 5 were also tested to evaluate the performance of the mounting when the motherboard was screwed at the  middle. In  addition, the different component layouts were anticipated to also have  significant effects on the mechanical behavior of the FPCB motherboard. Hence, a few possibilities of the component layouts were also examined, as shown in Fig. 9. In these layouts, the locations of the I/O connectors were not altered because of the idea that they are normally placed at the downstream of the motherboard. These layout investigations can clarify some questions on a few outcomes, such as the different orientations of the long memory slots and different locations of the two bigger components (heat sink and CPU fan).


Fig.9. different compontent layout

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "Humanized way to make Flex PCB". Choose us,
    you will have the best flex PCB and assembly partner.


© 2023-2033 FPCWAY All Rights Reserved