- Flex PCB Capability
- Flex PCB Capability
- Rigid-Flex PCB Capability
- Rigid PCB Capability
- Flex PCB Manufacture Process
- Our Flex PCB Factory
- FPC Layers Stack Up
- PCB Assembly Capability
FPCway mainly do flex PCB and Rigid-flex PCB, and with our 10+ years experience, we also become a professional Rigid PCB and PCB Assembly manufacturer in Shenzhen China since 2013 for rigid PCB like 1-48L FR4 PCB, HDI PCB, Rogers PCB, Aluminum PCB, Copper PCB, and other rigid PCB. Our services including electronic design, PCB manufacture, PCB assembly, components sourcing, SMT stencil, PCB/PCBA copy services, box build, injection molding, CNC.
We are continually upgrading our full feature PCB service with better equipment, more training and more efficient techniques to provide the highest quality, full feature PCB manufacturing and assembly for our clients. We hold ourselves to the highest standards of quality and efficiency, and our clients know it, coming to us from industries like consumer electronic, IOT, Automatic, aerospace, medical, telecommunications and education.
The following is the form of our standard Rigid PCB capabilities, if beyond these or need detailed capabilities, please contact us.
Standard Rigid PCB Capability | ||
Process | Items | Capability |
Panel | Biggest Panel Size | 1-2Layer：700×1200mm |
| Multilayer：600×1100mm | ||
PCB Thickness | Minimum PCB thickness | 0.06mm |
| Maximum PCB Thickness | 10.0mm | |
| PCB Bow and Twist | ≤0.7% | |
Base Material | Base Material Types | FR4 (Standard TG, Middle TG, High TG, Halogen Free) |
| Polymide | ||
| Rogers | ||
| Aluminum | ||
| Copper | ||
| Teflon | ||
| ARLON | ||
Copper Layer | Max Copper Layer | 48Layer |
| Inner Copper Thickness | 0.5/1/2/3/4/5/6OZ | |
Drilling | Minimum Hole Size | Board thickness≤2.0mm，minimum holes 0.1mm |
| Board thickness＞2.0mm，board thickness vs drill size=12:1 | ||
| Blind/Buried Vias | Yes | |
| Max hole Size | 6.0mm | |
| PTH Tolerance | ±0.075mm | |
| NPTH Tolerance | ±0.025 | |
Plated Through Hole | Minimum Hole Wall Copper thickness | 20um |
| Aspect Ratio | 10:1 | |
Circuit | Minimum Track Width/Space | 3mil/3mil |
| Minimum Space from Hole to Track | 0.18mm | |
| Minimum Annular Ring | Vias：3mil | |
| Soldering Holes：6mil | ||
Plating | Surface Finish | HASL Lead free/with lead, Electrolytic Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Golden Finger, ENEPIG, etc. |
| Finished Copper Thickness | Outer Copper：1-10oz | |
| Inner Copper：0.5-5oz | ||
| Electrolytic Gold | Nickle Thickness：100-200u” | |
| Gold Thickness：1-50u” | ||
| Immersion Gold | Nickle Thickness：80-150u” | |
| Gold Thickness：1-20u” | ||
| Golden Finger | Nickle Thickness：120-150u” | |
| Gold Thickness：1-40u” | ||
Etching | Original Copper thickness 1/3oz | Minimum Track Width/Space：3mil |
| Original Copper thickness 1/2oz | Minimum Track Width/Space：4mil | |
| Original Copper thickness 1oz | Minimum Track Width/Space：4-5mil | |
| Original Copper thickness 2oz | Minimum Track Width/Space：6mil | |
| Original Copper thickness 3oz | Minimum Track Width/Space：8mil | |
| Original Copper thickness 4oz | Minimum Track Width/Space：10.8mil | |
Solder Mask | Solder Mask Color | Green, Blue, Red, Yellow, Black, White, Purple, Matt Black, Matt Green, Peelable Solder Mask,etc. |
| Solder Mask Opening | 2-4mil | |
| Solder Mask Bridge | Minimum：4mil (between two adjacent pads of IC) | |
Silkscreen | Silkscreen Color | White, Black, Yellow, Red, Blue, Green, etc. |
| Text Width | 5mil | |
| Text Height | 30mil | |
Board Outline | CNC Tolerance | ±0.1mm |
| V-CUT Depth | ±0.1mm | |
| V-CUT Deviation | ±0.1mm | |
| V-CUT Angle | 20°, 30°, 60° | |
| Distance from track to board outline | CNC：0.25mm | |
| V-CUT：0.4mm | ||
Reliability | Flame Retardance | 94v-0 |
| Peel Strength | 12.3N/cm | |
| Insulation Resistance | ≥109Ω | |
| Impedance Control | +/-5%, +/-10% | |
| High-Voltage Insulation Test | Minimum 1500V | |
| thermal shock test | 288℃, 10seconds, 3times | |
