- Flex PCB Capability
- Flex PCB Capability
- Rigid-Flex PCB Capability
- Rigid PCB Capability
- Flex PCB Manufacture Process
- Our Flex PCB Factory
- FPC Layers Stack Up
- PCB Assembly Capability
FPCway is a professional flex PCB and flex-rigid PCB manufacturer from prototype to production in Shenzhen China since 2013. Our FPC and rigid-flex PCB boards have been highly used in Medical, Consumer Products, IOT, Industries, Wearables and Automative, etc.
The following is our flexible PCB capabilities for your reference.
Flex PCB Technical Capabilities | |||
FPC Layer | |||
| NO. | ITEM | Standard Capabilities | Special Capabilities |
| 1 | FPC Layer | 1-12L | 1-16L |
FPC Material | |||
| 2 | Base Material | PI (12.5um, 25um, 50um) | 100um |
| 3 | Copper Type | RA Copper: 12um, 18um, 35um, 70um ED Copper: 12um, 18um, 35um, 70um | 6um, 9um, 100um |
| 4 | PI Coverlay | 12.5um, 25um, 50um | 100um |
| 5 | Adhesive | PSA Adhesive: 50um-100um (3M467, Tesa 8853, Tesa 8854, etc.) | |
| 6 | Hot-Press Adhesive: 13um, 25um | ||
| 7 | Stiffeners | PI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) | |
| PET Stiffener: 0.125/0.188/0.25(mm) | |||
| FR4 Stiffener: 0.1mm-2.0mm | 2mm | ||
| SUS Stiffener: 0.1mm-0.6mm | |||
| Aluminum Stiffener: 0.2mm-2.0mm | |||
| 8 | EMI shielding film | HCF-6000G, PC800, etc. | 100um |
Board Size & Thickness | |||
| 9 | Biggest Board Size | 500mm*600mm | |
| 10 | Longest Board Size | 250mm*2520mm | |
| 11 | Biggest Board Thickness | 2.0mm | |
| 12 | Thinnest Board Thickness | 0.05mm | |
| 13 | Thickness Tolerance | 0.05mm～0.24mm: ±0.03mm 0.25mm～0.47mm: ±0.05mm | |
Drill | |||
| 14 | Minimum Hole Size | 0.1 mm | 0.025mm |
| 15 | Holes Size Tolerance | ±0.05 mm | |
| 16 | Holes Posistion Tolerance | ±0.05 mm | |
| 17 | Minimum vias Pad Size | 0.3mm | 0.2mm |
| 18 | Minimum Annular Ring Size | 0.1mm | 0.075mm |
| 19 | Blind/Buried Vias | Yes | |
Copper Tracks and Plating | |||
| 20 | Minimum Track Width/Space (35um Copper) | 0.1mm/0.1mm | |
| 21 | Minimum Track Width/Space (18um Copper) | 0.07mm/0.07mm | 0.05mm/0.05mm |
| 22 | Minimum Track Width/Space (12um Copper) | 0.04mm/0.04mm | 0.035mm/0.035mm |
| 23 | Track Width Tolerance | 20% | 0.02mm |
| 24 | Tracks/Pads Position Tolerance | ≥0.06 mm | ≥0.05 mm |
| 25 | Tracks/Pads To Board Edge | ≥0.15 mm | ≥0.05 mm |
| 26 | Golden Finger Pitch Tolerance | Pitch:10~20mm : ± 0.03mm, Pitch:20~50mm : ± 0.05mm | |
| 27 | Copper Plating Thickness | 8-20um | |
| 28 | Hole Copper Thickness | 8-20um | 35um |
| 29 | Minimum Copper Thickness for Hollow Out FPC | 35um | |
Surface Finish | |||
| 30 | ENIG | AU: 1-2u" Thickness NI: 40-120u" Thickness | 3u” Thickness |
| 31 | Electrolytic Nickel Gold (Hard Gold Plating) | AU: 1-50u” Thickness NI: 80-320u" Thickness | |
| 32 | Immersion Silver | Ag: 6-12u" Thickness | |
| 33 | OSP | 8-16u" Thickness | |
| 34 | Immersion Tin | SN: 10-60u" Thickness | |
| 35 | Tin Plating | SN: 5-30um Thickness | |
| 36 | ENEPIG | Au：1-4u" Thickness NI: 120-200u" Thickness Pd：1-6u" Thickness | |
Coverlay | |||
| 37 | Coverlay Opening Size Tolerance | ±0.1 mm | ±0.03 mm |
| 38 | Minimum Drilling Size on Coverlay Opening | 0.45mm | 0.2mm |
| 39 | Minimum Square Size on Coverlay Opening | 0.7mm*0.7mm | 0.2mm*0.2mm |
| 40 | Coverlay Opening Position Tolerance | ±0.1 mm | ±0.03 mm |
| 41 | Coverlay Align Tolerance | ±0.1 mm | ±0.02 mm |
| 42 | Excessive Glue | ≤0.15 mm | |
| 43 | Minimum Area of Excessive Glue | ≤20% Pads Area | |
Solder Mask and Silkscreen | |||
| 44 | Solder Mask Thickness | 15um +/-5um | |
| 45 | Solder Mask Tolerance For Opening Size | +/-0.05mm | +/-0.02mm |
| 46 | Solder Mask Tolerance For Opening Position | 0.1mm | +/-0.02mm |
| 47 | Minimum Silkscreen line width | 0.13mm | |
| 48 | Minimum Silkscreen Gap | 0.2mm | |
| 49 | Minimum Silkscreen Position Tolerance | +/-0.3mm | |
| 50 | Minimum Silkscreen height | 0.8mm | |
| 51 | Minimum Solder Mask Bridge | 0.13mm | |
Board Outline & Stiffeners | |||
| 52 | Board Outline Tolerance with Steel Die | ±0.1 mm | ±0.03mm |
| 53 | Board Outline Tolerance with Knife Die | ±0.2 mm | |
| 54 | Minimum Gap Between Drilling and Board Edge | ≥0.5 mm | |
| 55 | PSA Position Tolerance | ±0.2 mm | |
| 56 | Stiffeners Position Tolerance | ±0.2 mm | |
FPC E-Test | |||
| 57 | Test Voltage | 10-50V | |
| 58 | Insulation Test Impedance | ≥10MΩ | |
| 59 | Conduction Test Impedance | ≤50Ω | |
| 60 | Impedance Tolerance | 10% | |
FPC Physical Property | |||
| 61 | Solderability Test | 245±5℃, 3 Seconds For One Time, Soldering Area≥95% | |
| 62 | Thermal Shock Test | 288±5℃, 10 Seconds Per 3 Times, No Delamination and No Bubbles | |
| 63 | FCCL Peel Strength | ≥0.8kgf/㎠ (1cm width sample) | |
| 64 | Coverlay Peel Strength | ≥0.8kgf/㎠ (1cm width sample) | |
| 65 | Stiffeners Peel Strength | 0.15 N/mm (Hot-Press Adhesive) 0.49 N/mm (PSA Adhesive) | |
